A biaxially stretched polyimide film exhibiting superior mechanical strength and exceptional chemical stability for flexible electronic applications

• Superior Mechanical Integrity: Provides exceptional tensile strength and long-term durability.
• Dimensional Stability: Maintains shape and size with an ultra-low coefficient of thermal expansion (CTE).
• Adhesive Compatibility: Ensures strong and reliable bonds with a wide range of substrate materials.
• Environmental Compliance: Fully meets the requirements of global regulations, including RoHS and REACH.
• Safety Certification: Certified by UL for safe use in the U.S. market.

• Precision Adhesive Flexible Copper Clad Laminates (FCCLs)
• Dimensionally Stable Cover Layers
• Semiconductor Die Packaging Solutions
• Specialty Adhesive Substrate Tapes

Advantageous Sourcing: Access competitive pricing and flexible MOQs directly from our manufacturing facility.
• Tailored Solutions: Leverage our technical expertise for product customization and packaging.
• Material Specifications: Choose from a range of custom thicknesses, widths, and surface treatments (matte, glossy, metallic).
• Quality & Delivery Assurance: Receive guaranteed high-quality products with fast and reliable lead times.
• Cost Efficiency & Evaluation: Benefit from attractive volume pricing and request free product samples.

• Shelf Life: 6 months (from date of manufacture)
• Storage Conditions: Cool, dry place. Protect from direct sunlight.
• Environmental Protection: Avoid high humidity and extreme temperature variations.