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Copper-coated polyimide film applied in flexible circuit scenarios

Copper-coated polyimide film applied in flexible circuit scenarios

MOQ: 150 kg
Price: $300-$30000
standard packaging: Standardowe pakowanie
Delivery period: 7 dni roboczych
payment method: L/C, T/T.
Supply Capacity: Negocjacja
Informacje szczegółowe
Miejsce pochodzenia
CHINY
Nazwa handlowa
Guofeng
Orzecznictwo
SGS Reach ROHS
Numer modelu
25um
Materiał okładzinowy:
Miedź
Obróbka powierzchniowa:
Trawienie chemiczne
Tworzywo:
Poliimid
Typ kleju:
Akryl
Podkreślić:

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Product Description
               Copper-coated polyimide film applied in flexible circuit scenarios
Product Overview:

The GL series represents a breakthrough in polyimide film performance. Its exclusive manufacturing process forms a distinctively oriented molecular structure, enhancing critical properties—including tensile strength, dimensional stability, and chemical resistance—by a steady 30%. This adaptable, inherently yellow film offers customizable thickness options and serves as the perfect solution for high-demand applications such as adhesive substrates and advanced chip packaging.

Place of Origin:
ANHUI, CHINA
Material:
Polyimide
Color:
Yellow
Treatment:
Single-side / Both Sides
Width:
514MM, 520MM, 1028MM, 1040MM
Thickness:
custom
Packaging:
vacuum packaging
Supply Ability:
2000 ton/year
Product Features:

Robust Mechanical Durabilit

Exceptional Dimensional Integrity

Excellent Lamination Performance
Compliant with RoHS and REACH


Product Applications:
  1. Acts as a base material for high-precision adhesive Flexible Copper Clad Laminates (FCCL)
  2. Serves as a cover layer with exceptional dimensional stability
  3. Utilized in the packaging of semiconductor chips
  4. Functions as a base film for specialized adhesive tapes



Product Images:

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Company Image:

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