Polyimide Base Film for Flexible Circuits & Semiconductor Packaging Applications

Polyimide Base Film for Flexible Circuits & Semiconductor Packaging Applications  

Flexible Printed Circuit Base Film: High Dimensional Stability Polyimide

GL-Type Polyimide Film offers excellent thermal stability, electrical insulation, and dimensional reliability. With its opaque black appearance, it is widely used in electronics, flexible circuits, and semiconductor packaging, providing both performance and light-blocking protection.

• It has extremely high mechanical properties.
  It has an extremely low coefficient of thermal expansion.
• It has excellent surface bonding properties.
  The product complies with RoHS and Reach requirements and has passed safety certification by the UL laboratory in the United States.

The GL high-performance polyimide film is primarily used in high-precision adhesive FCCL substrates, high-stability cover films, chip packaging, and special adhesive tape substrates.

• Direct Manufacturer Pricing: Eliminate intermediaries—competitive costs, flexible MOQs, and fast delivery.
• Technical Expertise: Customized anti-fog testing for your product, and support to optimize packaging performance.

Available in custom thicknesses, widths, and finishes (matte, glossy, metallic), our Polyimide film ensures consistent quality, fast production, and competitive pricing for bulk orders. Contact us today for free samples & wholesale deals!

To ensure the longevity and performance of our Polyimide film, please adhere to the following guidelines:

• Shelf Life: 6 months from the date of manufacture.
• Storage Conditions:

  · Store in a cool, dry place away from direct sunlight will be necessary.

  · Avoid exposure to high humidity or extreme temperature fluctuations.