Ultra High Temperature Tolerant Polyimide Masking Tape Utilized in PCB Manufacturing & Electrostatic Powder Coating Operations

High-Temperature Clear Polyimide Masking Tape for PCB & Powder Coating Applications

Our independently researched, developed and in-house produced high-performance polyimide films of GL grade adopt biaxial stretching intrinsic yellow polyimide raw material. This item is offered in three thickness variants with separate performance indicators, primarily acting as adhesive substrate materials, semiconductor chip encapsulation medium, alongside various matching industrial application fields.

It boasts outstanding mechanical strength and structural durability.

It features a remarkably low thermal expansion coefficient.

It delivers superior interfacial adhesion performance.

This item meets RoHS and REACH regulatory standards and has obtained safety approvals issued by UL Labs of America.

GL grade premium polyimide thin films are mainly applied for high-accuracy adhesive FCCL base layers, steady coverlay materials, chip encapsulation as well as specialized masking tape substrates.

To ensure the longevity and performance of our Polyimide film, please adhere to the following guidelines:

• Shelf Life: 6 months from the date of manufacture.
• Storage Conditions:
  • Store in a cool, dry place away from direct sunlight will be necessary.
  • Avoid exposure to high humidity or extreme temperature fluctuations.