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ODM Polyimide Film Adhesive Base Material for Circuit & Chip Encapsulation

ODM Polyimide Film Adhesive Base Material for Circuit & Chip Encapsulation

Quantité Minimale De Commande: 150 kg
Prix: $300-$30000
Emballage Standard: EMBALLAGE STANDARD
Période De Livraison: 7 jours ouvrables
Mode De Paiement: LC, T/T
Capacité D'approvisionnement: Négociation
Informations détaillées
Lieu d'origine
Chine
Nom de marque
Guofeng
Certification
SGS Reach ROHS
Numéro de modèle
25um
Mettre en évidence:

polyimide film adhesive base material

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circuit encapsulation polyimide film

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chip encapsulation copper clad film

Description du produit
 ODM Polyimide Film Adhesive Base Material for Circuit & Chip Encapsulation
Product Overview

The GL high-performance polyimide film is a type of biaxially stretched natural (yellow) polyimide film, developed and produced independently by our company. Available in various thicknesses and characteristics, it is primarily used in adhesive substrates, chip packaging, and other specialized applications.

Place of Origin:
ANHUI, CHINA
Certification:
SGS, FDA
Material:
Polyimide
Color:
Yellow
Treatment:
Single-side / Both Sides
Width:
514MM, 520MM, 1028MM, 1040MM
Thickness:
5μm, 7.5μm, 11μm, 12.5μm, 25μm, 50μm, 70μm, 75μm, 100μm
Packaging:
Wooden pallet
Supply Ability:
2000 ton/year
Product Features
  • Extremely high mechanical properties
  • Extremely low coefficient of thermal expansion
  • Excellent surface bonding properties
  • Complies with RoHS and Reach requirements
  • UL laboratory safety certified (United States)
Product Applications

The GL high-performance polyimide film is primarily used in:

  • High-precision adhesive FCCL substrates
  • High-stability cover films
  • Chip packaging
  • Special adhesive tape substrates
Why Choose Our Factory?
  • Direct Manufacturer Pricing: Eliminate intermediaries with competitive costs, flexible MOQs, and fast delivery
  • Technical Expertise: Customized anti-fog testing and packaging optimization support

Available in custom thicknesses, widths, and finishes (matte, glossy, metallic), our Polyimide film ensures consistent quality, fast production, and competitive pricing for bulk orders. Contact us today for free samples & wholesale deals!

Handling & Storage Instructions

To ensure the longevity and performance of our Polyimide film:

  • Shelf Life: 6 months from the date of manufacture
  • Storage Conditions:
    • Store in a cool, dry place away from direct sunlight
    • Avoid exposure to high humidity or extreme temperature fluctuations
Product Images

ODM Polyimide Film Adhesive Base Material for Circuit & Chip Encapsulation 0

ODM Polyimide Film Adhesive Base Material for Circuit & Chip Encapsulation 1