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High-Stability Copper-Polyimide Laminates Suitable for Cyclic Flexing Scenarios
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High-Stability Copper-Polyimide Laminates Suitable for Cyclic Flexing Scenarios
| MOQ: | 150 kg |
| Cena: | $300-$30000 |
| Standardowe opakowanie: | STANDARDOWE OPAKOWANIE |
| Okres dostawy: | 7 dni roboczych |
| Metoda płatności: | L/C, T/T |
| Wydajność dostaw: | Negocjacja |
Informacje szczegółowe
Miejsce pochodzenia
Chiny
Nazwa handlowa
Guofeng
Orzecznictwo
SGS Reach ROHS
Numer modelu
25um
Materiał okładzinowy:
Miedź
Obróbka powierzchniowa:
Trawienie chemiczne
Tworzywo:
Poliimid
Typ kleju:
Akryl
Podkreślić:
High-Stability Copper-Polyimide Laminates
,Flexible Polyimide Film for Cyclic Flexing
,Copper-Polyimide Laminates with High Stability
Opis produktu
High-Stability Copper-Polyimide Laminates Suitable for Cyclic Flexing Scenarios
Product Overview:
The GL series polyimide substrates forge unprecedented performance benchmarks across the polyimide film sector. Leveraging in-house developed fabrication techniques, our product re-engineers the intrinsic molecular structure at the fundamental level. Compared with generic PI film goods, its core functional indicators such as tensile performance, dimensional stability and chemical corrosion resistance see a more than 30% performance uplift.
Place of Origin:
ANHUI, CHINA
Material:
Polyimide
Color:
Yellow
Treatment:
Single-side / Both Sides
Width:
514MM, 520MM, 1028MM, 1040MM
Thickness:
custom
Packaging:
vacuum packaging
Supply Ability:
2000 ton/year
Product Features:
excellent Mechanical Performance
Remarkable Dimensional Consistency
Premium Bonding Compatibility
Compliant with RoHS & REACH Directives
Product Applications:
High-density flexible copper-clad laminates (FCCL) dedicated to FPC manufacturing
Dimensionally consistent cover films offering circuit shielding protection
Cutting-edge encapsulation & packaging materials for semiconductor components
High-spec base films formulated for specialized adhesive tape applications
Dimensionally consistent cover films offering circuit shielding protection
Cutting-edge encapsulation & packaging materials for semiconductor components
High-spec base films formulated for specialized adhesive tape applications
To retain the original properties and functional reliability of our polyimide films, kindly observe the below storage requirements:
- Shelf Life: 6 months from the manufacturing date.
- Optimal Environment: Store in a cool, dry place with stable ambient conditions.
- Protection Measures: Keep the original packaging sealed and protect from direct sunlight, moisture, and extreme temperatures.
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