Colorless Polyimide Film

Flexible Printed Circuit (FPC) Substrate
July 31, 2025
Category Connection: Película FPC
Brief: Discover the advanced Colorless Polyimide FPC Film, designed for flexible printed circuits with thickness options from 5μm to 100μm. This high-performance film offers exceptional thermal stability, superior optical clarity, and excellent chemical resistance, making it ideal for next-generation flexible electronics.
Related Product Features:
  • Exceptional thermal stability up to 200°C for high-temperature applications.
  • Superior optical clarity with >90% transmittance and minimal yellowing.
  • Highly flexible material suitable for demanding flexible electronics.
  • Excellent chemical resistance ensures durability in harsh environments.
  • Available in various thicknesses from 5μm to 100μm for versatile use.
  • Multiple circuit layer options including single-sided, double-sided, and multi-layer.
  • Highly conductive with immersion gold surface finish for optimal performance.
  • Width of 1040mm accommodates a wide range of industrial applications.
FAQ:
  • What is the temperature resistance of the Colorless Polyimide Film?
    The film can withstand temperatures up to 200°C, making it suitable for high-temperature applications.
  • What are the available thickness options for this film?
    The film is available in thicknesses ranging from 5μm to 100μm to meet various application needs.
  • What makes this polyimide film suitable for flexible electronics?
    Its high flexibility, superior optical clarity, and excellent chemical resistance make it ideal for flexible electronics and optoelectronic applications.