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OEM Dielectric Film Adhesiveless Polyimide For High Speed Electronics
| MOQ: | 5kg |
| Price: | $300-$30000 |
| Standard Packaging: | Barrier+ PE foam sheet+ PE film+ Foam packing cotton |
| Delivery Period: | Negotiation |
| Payment Method: | L/C,T/T |
| Supply Capacity: | Negotiation |
Detail Information
Place of Origin
China
Brand Name
Guofeng
Certification
RoHS，UL，ISO
Model Number
GL-25(G)
Flame Retardant:
UL 94 V-0
Transparency:
High
Dielectric Constant:
3.0
Elongation At Break:
100%
Chemical Resistance:
Excellent
Uv Resistance:
Good
Highlight:
OEM Dielectric Film
,polyimide Dielectric Film
,adhesiveless polyimide Film
Product Description
Low-Dk Polyimide Film GL-25G for High-Speed Electronics
Product Overview
Low-Dielectric Polyimide Film (Low-Dk PI Film) is an advanced polymer material engineered to exhibit ultra-low dielectric constant (Dk < 3.0) and minimal dielectric loss (Df < 0.005) across high-frequency ranges (1 MHz-100 GHz). It retains the intrinsic thermal stability (>300°C) and mechanical robustness of polyimide while addressing signal integrity demands in high-speed electronics.
Key Characteristics
- Ultra-low dielectric constant (Dk < 3.0)
- Minimal dielectric loss (Df < 0.005)
- Excellent performance across 1 MHz-100 GHz frequency range
- High thermal stability (>300°C)
- Maintains mechanical robustness of standard polyimide
- Optimized for high-speed electronic applications
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