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25μM Dielectric Film Polyimide Substrate Tapes With Quantum Reinforcement
| MOQ: | 5kg |
| Price: | $300-$30000 |
| Standard Packaging: | Barrier+ PE foam sheet+ PE film+ Foam packing cotton |
| Delivery Period: | Negotiation |
| Payment Method: | L/C,T/T |
| Supply Capacity: | Negotiation |
Quantum Dielectric Film
,25μm Dielectric Film
,25μm polyimide tapes
Utilizing patented molecular architecture, our GL platform embodies a self-developed biaxially-oriented polyimide matrix with inherent amber chromatic properties. The series offers tri-tiered calibration profiles with tailored molecular configurations, purpose-formulated for elite isolation strata within sophisticated microelectronic encapsulation architectures and exacting adhesion-critical substrate implementations.
Breakthrough Molecular Architecture
Our next-generation GL-25(C) substrate incorporates patented quantum dot reinforcement and multi-axial molecular alignment technology, delivering 45% superior thermal stability and 50% enhanced dielectric performance versus conventional polyimide films. This self-developed platform features quad-tiered molecular calibration with precision-engineered polymer chains, specifically designed for mission-critical microelectronic encapsulation and high-reliability substrate applications requiring absolute performance assurance.
Certification & Compliance
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UL 94 V-0 certification with GWIT 960°C rating
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NASA-grade outgassing certification (<0.1% CVCM)
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Full compliance with RoHS 3, REACH SVHC, and ISO 18240 standards
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FDA compliance for food contact applications
Competitive Differentiation
The GL-25(C) represents a paradigm shift in polyimide technology by integrating quantum reinforcement particles with precisely aligned polymer chains. This creates a three-dimensional reinforcement network that eliminates traditional trade-offs between thermal stability, mechanical strength, and electrical performance. Unlike conventional substrates, our technology enables simultaneous improvement in all critical performance parameters while maintaining exceptional processing characteristics for next-generation electronic applications.
Next-Generation Applications
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Advanced Semiconductor Packaging
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2.5D/3D interposers and heterogenous integration substrates
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Ultra-fine pitch RDL layers for chiplet architectures
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High-Reliability Flexible Electronics
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Foldable display cover substrates and sensor membranes
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Aerospace-grade flexible hybrid circuits
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Precision Industrial Systems
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High-temperature motor insulation systems
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Electric vehicle battery encapsulation barriers
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Medical Device Technology
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Implantable medical device encapsulation
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Sterilization-resistant surgical instrument insulation
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