25μM Dielectric Film Polyimide Substrate Tapes With Quantum Reinforcement

Competitive Differentiation

The GL-25(C) represents a paradigm shift in polyimide technology by integrating quantum reinforcement particles with precisely aligned polymer chains. This creates a three-dimensional reinforcement network that eliminates traditional trade-offs between thermal stability, mechanical strength, and electrical performance. Unlike conventional substrates, our technology enables simultaneous improvement in all critical performance parameters while maintaining exceptional processing characteristics for next-generation electronic applications.

Next-Generation Applications

1. Advanced Semiconductor Packaging

   • 2.5D/3D interposers and heterogenous integration substrates

   • Ultra-fine pitch RDL layers for chiplet architectures

2. High-Reliability Flexible Electronics

   • Foldable display cover substrates and sensor membranes

   • Aerospace-grade flexible hybrid circuits

3. Precision Industrial Systems

   • High-temperature motor insulation systems

   • Electric vehicle battery encapsulation barriers

4. Medical Device Technology

   • Implantable medical device encapsulation

   • Sterilization-resistant surgical instrument insulation