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High-Adhesion Opaque Black Film for FPC – Engineered for Flexible Circuits with Superior Thermal Stability and High-Grade Electrical Insulation Properties
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High-Adhesion Opaque Black Film for FPC – Engineered for Flexible Circuits with Superior Thermal Stability and High-Grade Electrical Insulation Properties
| MOQ: | Negotiation |
| Price: | $300-$30000 |
| Standard Packaging: | Standard Packing |
| Delivery Period: | Negotiation |
| Payment Method: | L/C,T/T |
| Supply Capacity: | Negotiation |
Detail Information
Place of Origin
China
Brand Name
Guofeng
Certification
UL ISO ROHS
Model Number
7.5um
Chemical Resistance:
Excellent
Adhesive Strength:
High
Electrical Insulation:
High
Flexibility:
Flexible
Mechanical Strength:
Strong
Material:
Polyimide
Highlight:
Light-Shielding Polyimide Film
,25um PI Film
,High Electrical Insulation FPC Polyimide Material
Product Description
High-Adhesion Opaque Black Film for FPC – Engineered for Flexible Circuits with Superior Thermal Stability and High-Grade Electrical Insulation Properties
High-performance black polyimide film specifically designed for flexible printed circuit applications with superior light-shielding properties.
| Place of Origin | ANHUI, CHINA |
| Certification | UL ISO ROHS |
| Material | Polyimide |
| Color | Yellow |
| Treatment | Single-side / Both Sides |
| Width | 514MM 520MM 1028MM 1040MM |
| Thickness | 12.5μm 18μm 20μm 25μm |
| Packing Style | Standard Packing |
| Roll Length | Customized |
| Packaging Details | Wooden pallet |
| Supply Ability | 2000 ton/year |
Product Overview
The GL Series High-Performance Polyimide Film is a biaxially oriented native (yellow) polyimide film, independently developed and manufactured by our company. Available in three variants with distinct thicknesses and performance characteristics, it is primarily used in adhesive substrates, chip encapsulation, and related application fields.
Product Features
- Exceptionally robust mechanical performance across a full range of stress tests
- Ultra-low thermal expansion coefficient (CTE) ensuring dimensional stability under extreme temperature fluctuations
- Superior surface adhesion characteristics for reliable bonding with diverse substrate materials
- Complies with RoHS and REACH regulatory requirements and holds UL safety certification
Product Applications
The GL Series High-Performance Polyimide Film serves as a key material in high-precision adhesive-based FCCL substrates, high-stability coverlay films, semiconductor chip encapsulation, and specialty adhesive tape substrates.
Why Choose Our Factory?
Factory-Direct Pricing: Eliminate intermediaries to secure cost-competitive pricing, flexible minimum order quantities, and expedited delivery timelines.
Professional Technical Support: Custom anti-fog testing protocols aligned with your requirements, plus dedicated technical assistance to enhance packaging performance metrics.
Available with custom-specified thicknesses, widths, and surface finishes (matte, glossy, metallic), our polyimide film guarantees uniform quality, efficient production lead times, and favorable pricing for large-volume orders. Contact us for complimentary samples and bulk purchase negotiations!
Product Images
Handling & Storage Instructions
To preserve long-term durability and optimal performance of our Polyimide Film, please comply with the following storage guidelines:
Shelf Life: Valid for 6 months from the date of production.
Storage Requirements:
- Store in a cool, dry environment protected from direct sunlight
- Avoid contact with high-humidity conditions or drastic temperature fluctuations
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