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Ultra-Fine-Thickness, High-Efficiency PI Membranes Tailored for Next-Generation Tech Applications

Ultra-Fine-Thickness, High-Efficiency PI Membranes Tailored for Next-Generation Tech Applications

MOQ: Negotiation
Price: $300-$30000
Standard Packaging: Standard Packing
Delivery Period: Negotiation
Payment Method: L/C,T/T
Supply Capacity: Negotiation
Detail Information
Place of Origin
China
Brand Name
Guofeng
Certification
UL ISO ROHS
Model Number
7.5um
Dielectric Constant:
Low Dielectric Constant
Dimensional Stability:
Low Coefficient Of Thermal Expansion
Dielectric Strength:
High Dielectric Strength
Material Type:
Thermosetting Polymer
Color:
Yellow
Electrical Insulation:
Excellent Electrical Insulation Properties
Mechanical Strength:
High Strength And Stiffness
Water Absorption:
Low Water Absorption
Thermal Conductivity:
Low Thermal Conductivity
Highlight:

ultra-fine PI membranes

,

high-efficiency PI material

,

next-generation tech PI membranes

Product Description
Ultra-Fine-Thickness, High-Efficiency PI Membranes Tailored for Next-Generation Tech Applications
Detail Information
Place of Origin:
ANHUI, CHINA
Certification:
UL ISO ROHS
Material:
Polyimide
Color:
Yellow
Treatment:
Single-side / Both Sides
Width:
514MM 520MM 1028MM 1040MM
Thickness:
12.5μm 18μm 20μm 25μm
Packing Style:
Standard Packing
Application:

Roll Length:
Customized
Packaging Details:
Wooden pallet
Supply Ability:
2000 ton/year
Highlight:
Flexible Electronics Polyimide Film with Excellent Thermal and Electrical Properties
Product Description

Ultra-Fine-Thickness, High-Efficiency PI Membranes Tailored for Next-Generation Tech Applications

Product Overview

Our GL premium-grade polyimide film is an inherently tinted (amber-hued) biaxially oriented variant, independently R&D-developed and in-house manufactured by our team. It comes in three distinct thickness options with customized properties, and is mainly deployed in adhesive tape substrates, semiconductor chip encapsulation, and related high-tech fields.

Product Features

Boasting exceptional mechanical strength and rigidity, this film also features an ultra-low coefficient of thermal expansion. Its surface exhibits outstanding bonding compatibility, while the product fully adheres to RoHS and REACH standards and has obtained official safety certification from the U.S.-based UL Laboratories.

Product Applications

Our GL high-performance polyimide film is predominantly engineered for high-precision adhesive FCCL substrates, high-stability cover films, microchip encapsulation solutions, as well as specialized adhesive tape base materials.

Why Choose Our Factory?

Factory-Direct Pricing Advantage: Cut out middleman markups to secure cost-competitive rates, flexible minimum order quantities, and expedited delivery timelines.

Product pictures

Ultra-Fine-Thickness, High-Efficiency PI Membranes Tailored for Next-Generation Tech Applications 0

Ultra-Fine-Thickness, High-Efficiency PI Membranes Tailored for Next-Generation Tech Applications 1

Handling & Storage Instructions

To ensure the longevity and performance of our Polyimide film, please adhere to the following guidelines:

  • Shelf Life: 6 months from the date of manufacture.
  • Storage Conditions:
    • Store in a cool, dry place away from direct sunlight will be necessary.
    • Avoid exposure to high humidity or extreme temperature fluctuations.