| MOQ: | Negotiation |
| Price: | $300-$30000 |
| Standard Packaging: | Standard Packing |
| Delivery Period: | Negotiation |
| Payment Method: | L/C,T/T |
| Supply Capacity: | Negotiation |
Cutting-Edge Flexible Electronic Modules – Bespoke PI Polyimide Thin Films
Our in-house self-developed GL premium-performance polyimide film is a biaxially oriented natural yellow-hued variant, supplied with three distinct thickness options and matching performance traits. It finds primary application in adhesive base materials, semiconductor chip encapsulation, and related sectors.
This product boasts exceptionally robust mechanical performance across diverse operating conditions. It also exhibits an ultra-low coefficient of thermal expansion, ensuring dimensional stability under extreme temperature fluctuations. In addition, it delivers superior surface adhesion capabilities, enabling reliable lamination with a wide range of partner materials. Fully compliant with RoHS and REACH regulatory standards, the item has successfully obtained safety certification from the U.S.-based UL Laboratories.
Product Applications
The GL high-performance polyimide film is primarily used in high-precision adhesive FCCL substrates, high-stability cover films, chip packaging, and special adhesive tape substrates.
Offered with tailored thicknesses, dimensions, and surface textures (matte, high-gloss, or metallic finishes), our Polyimide film delivers consistent quality standards, swift manufacturing lead times, and cost-effective pricing for large-volume orders. Reach out to our team today to claim complimentary samples and exclusive wholesale packages!
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To ensure the longevity and performance of our Polyimide film, please adhere to the following guidelines:
Store in a cool, dry place away from direct sunlight will be necessary.
Avoid exposure to high humidity or extreme temperature fluctuations.