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Polyimide film clad with copper used in flexible circuit settings

Copper Clad Polyimide Film
October 20, 2025
Category Connection: PI Material
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Tags:
#pi plastic material #transparent polyimide film #polyimide pi film
Brief: Discover the Ultra-Thin, High-Performance PI Films for Advanced Tech, perfect for flexible circuit settings. These polyimide films clad with copper offer exceptional thermal and electrical properties, ideal for adhesive substrates and chip packaging. Made in China with UL, ISO, and ROHS certifications, they come in customizable thicknesses and widths for versatile applications.
Related Product Features:
  • Ultra-thin polyimide film with excellent thermal and electrical properties for advanced tech applications.
  • Available in multiple thicknesses (12.5μm, 18μm, 20μm, 25μm) and widths (514MM, 520MM, 1028MM, 1040MM).
  • High mechanical properties and low coefficient of thermal expansion for durability.
  • Excellent surface bonding properties for reliable performance in flexible electronics.
  • Complies with RoHS and Reach requirements, certified by UL laboratory for safety.
  • Customizable in thickness, width, and finishes (matte, glossy, metallic) to meet specific needs.
  • Ideal for high-precision adhesive FCCL substrates, chip packaging, and special adhesive tape substrates.
  • Direct manufacturer pricing with flexible MOQs, fast delivery, and technical support for customization.
Faqs:
  • What are the key applications of Ultra-Thin, High-Performance PI Films?
    These films are primarily used in high-precision adhesive FCCL substrates, high-stability cover films, chip packaging, and special adhesive tape substrates.
  • What certifications does the product have?
    The product is certified by UL, ISO, and ROHS, ensuring compliance with safety and environmental standards.
  • Can the film be customized for specific requirements?
    Yes, the film can be customized in thickness, width, and finishes (matte, glossy, metallic) to meet your specific application needs.
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