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Copper-coated polyimide film applied in flexible circuit scenarios

Copper Clad Polyimide Film
October 14, 2025
Category Connection: Copper Clad Polyimide Film
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Tags:
#pi heating film #polyimide substrate #polyamide imide film
Brief: Discover the advanced GL series copper-clad polyimide film, designed for flexible circuit applications. This high-performance film offers enhanced tensile strength, dimensional stability, and chemical resistance, making it ideal for adhesive substrates and chip packaging. Custom thicknesses available.
Related Product Features:
  • Robust mechanical durability for long-lasting performance.
  • Exceptional dimensional integrity ensures precision in applications.
  • Excellent lamination performance for seamless integration.
  • Compliant with RoHS and REACH environmental standards.
  • Available in custom thicknesses to meet specific needs.
  • Naturally yellow polyimide film with superior chemical resistance.
  • Versatile use in adhesive substrates and advanced chip packaging.
  • High supply ability of 2000 tons per year.
Faqs:
  • What are the key applications of copper-clad polyimide film?
    It serves as a base material for high-precision adhesive Flexible Copper Clad Laminates (FCCL), functions as a highly dimensionally stable cover layer, is applied in semiconductor chip packaging, and used as a base film for specialized adhesive tapes.
  • Is the copper-clad polyimide film compliant with environmental standards?
    Yes, the film is compliant with RoHS and REACH environmental standards, ensuring safe and sustainable use.
  • What are the available widths and thicknesses for this product?
    The film is available in widths of 514MM, 520MM, 1028MM, and 1040MM, with custom thicknesses to meet specific requirements.
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