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Polyimide film clad with copper used in flexible circuit settings
| MOQ: | 150 kg |
| Price: | $300-$30000 |
| Standard Packaging: | Embalaje estándar |
| Delivery Period: | 7 días hábiles |
| Payment Method: | L/C, T/T |
| Supply Capacity: | Negociación |
Información Detallada
Lugar de origen
PORCELANA
Nombre de la marca
Guofeng
Certificación
SGS Reach ROHS
Número de modelo
25um
Material de revestimiento:
Cobre
Tratamiento superficial:
Grabado químico
Material:
Poliimida
Tipo adhesivo:
Acrílico
Resaltar:
flexible circuit polyimide film
,copper clad polyimide film
,polyimide film with copper
Product Description
Polyimide film clad with copper used in flexible circuit settings
Product Overview:
Copper-Clad Polyimide Film (abbreviated as PI Copper Foil) is a high-performance composite material specifically developed for flexible circuit scenarios. It combines high-purity copper foil with a polyimide (PI) base film through a precision lamination process, integrating the bend resistance of flexible substrates and the electrical conductivity of metal conductors. As a core foundational material for flexible electronic devices, it enables the realization of "thinness, lightness, bendability, and high reliability"
Place of Origin:
ANHUI, CHINA
Material:
Polyimide
Color:
Yellow
Treatment:
Single-side / Both Sides
Width:
514MM, 520MM, 1028MM, 1040MM
Thickness:
custom
Packaging:
vacuum packaging
Supply Ability:
2000 ton/year
Product Features:
Robust Mechanical Durabilit
Exceptional Dimensional Integrity
Excellent Lamination Performance
Compliant with RoHS and REACH
Product Applications:
- Consumer Electronics Field
- Industrial and Medical Field
- Medical equipment
- Flexible solar cells
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