Polyimide film clad with copper used in flexible circuit settings Product Overview: Copper-Clad Polyimide Film (abbreviated as PI Copper Foil) is a high-performance composite material specifically developed for flexible circuit scenarios . It combines high-purity copper foil with a polyimide (PI) base film through a precision lamination process, integrating the bend resistance of flexible substrates and the electrical conductivity of metal conductors. As a core foundational