Product Details:
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Film Appearance: | The Substrate Must Maintain Nanometer-level Planarity While Demonstrating Complete Absence Of Topological Defects, Particulate Inclusions, Polymeric Agglomerations, Or Extraneous Contamination Across Its Entire Functional Area. | Film Thickness: | 25μm |
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Film Tensile Strengthh: | 480MPa | Film Elongation At Break: | 40% |
Film Young's Modulus: | 7GPa | Film Insulation Strength: | 350V/μm |
Film Moisture Absorption: | 1425Kg/m³ | Film Thermal Shrinkage(200°,2h): | 0.04% |
Film Linear Expansion Coefficient: | 8ppm | Film Moisture Absorption Rate: | 1.8% |
Highlight: | Thermostable Dielectric Film,ODM Dielectric Film,Thermostable polyimide material |
Designed through cutting-edge molecular engineering, this high-performance substrate provides unparalleled structural durability, dielectric strength, and thermal endurance. Its exceptional surface compatibility guarantees faultless integration in precision assemblies, while carrying full international eco-compliance certifications (RoHS/REACH) and UL safety validation for global deployment.
Serving as pivotal enabling substrates for forthcoming electronics generations, GL-class polyimide matrices provide system-essential performance criteria throughout: 1) sub-micron tolerance bonded flexible circuit constructs, 2) dimensionally immutable barrier overlay configurations, 3) state-of-the-art semiconductor encapsulation ecosystems, and 4) function-engineered adhesive tape systems with customized viscoelastic profiles.
Contact Person: Jihao
Tel: +86 18755133999
Fax: 86-0551-68560865