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Thermostable Dielectric Film Polyimide Material Substrate Amber ODM
| MOQ: | 5kg |
| Price: | $300-$30000 |
| Standard Packaging: | Barrier+ PE foam sheet+ PE film+ Foam packing cotton |
| Delivery Period: | Negotiation |
| Payment Method: | L/C,T/T |
| Supply Capacity: | Negotiation |
Thermostable Dielectric Film
,ODM Dielectric Film
,Thermostable polyimide material
Utilizing patented molecular architecture, our GL platform embodies a self-developed biaxially-oriented polyimide matrix with inherent amber chromatic properties. The series offers tri-tiered calibration profiles with tailored molecular configurations, purpose-formulated for elite isolation strata within sophisticated microelectronic encapsulation architectures and exacting adhesion-critical substrate implementations.
Designed through cutting-edge molecular engineering, this high-performance substrate provides unparalleled structural durability, dielectric strength, and thermal endurance. Its exceptional surface compatibility guarantees faultless integration in precision assemblies, while carrying full international eco-compliance certifications (RoHS/REACH) and UL safety validation for global deployment.
Functioning as a foundational industrial component, GL-grade polyimide membrane provides critical material infrastructure for manufacturing: 1) flexible circuit protective layering systems, 2) ultra-compact interconnective components, and 3) next-generation dielectric isolation barriers.
Serving as pivotal enabling substrates for forthcoming electronics generations, GL-class polyimide matrices provide system-essential performance criteria throughout: 1) sub-micron tolerance bonded flexible circuit constructs, 2) dimensionally immutable barrier overlay configurations, 3) state-of-the-art semiconductor encapsulation ecosystems, and 4) function-engineered adhesive tape systems with customized viscoelastic profiles.
