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Durable Copper-Polyimide Composite Solution for Repeated Flexing Applications
| MOQ: | 150kg |
| Price: | $300-$30000 |
| Standard Packaging: | Standard Packing |
| Delivery Period: | 7 Working Days |
| Payment Method: | L/C,T/T |
| Supply Capacity: | Negotiation |
durable copper-polyimide FPC film
,flexible printed circuit composite film
,repeated flexing copper-polyimide solution
The GL series sets a fresh benchmark in polyimide film performance. Our proprietary manufacturing technology builds a fundamentally enhanced molecular architecture, guaranteeing performance boosts of more than 30% in critical properties like tensile strength, dimensional stability, and chemical resistance over conventional options. This high-performance, natural yellow polyimide film can be customized in thickness, cementing its role as the essential material for mission-critical applications such as high-reliability adhesive substrates and advanced chip packaging.
Outstanding Mechanical Strength
Exceptional Dimensional Stability
Superior Laminating Properties
Conforms to RoHS and REACH regulations
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High-density flexible copper clad laminates (FCCL) for FPC fabrication
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Dimensionally stable coverlays for circuit protection
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Advanced encapsulation and packaging for semiconductor devices
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High-performance substrates for specialty adhesive tapes
To preserve the integrity and performance of our Polyimide film, please adhere to the following storage guidelines:
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Shelf Life: 6 months from the manufacturing date.
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Optimal Environment: Store in a cool, dry place with stable ambient conditions.
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Protection Measures: Keep the original packaging sealed and protect from direct sunlight, moisture, and extreme temperatures.
