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Polyimide Core Film Used in Flexible Printed Circuits and Semiconductor Packaging
| MOQ: | Negotiation |
| Price: | $300-$30000 |
| Standard Packaging: | Standard Packing |
| Delivery Period: | Negotiation |
| Payment Method: | L/C,T/T |
| Supply Capacity: | Negotiation |
Polyimide film for flexible circuits
,FPC film for semiconductor packaging
,Polyimide base film with high heat resistance
Polyimide Core Film Used in Flexible Printed Circuits and Semiconductor Packaging
Flexible Printed Circuit Base Film: High Dimensional Stability Polyimide
- It has extremely high mechanical properties.
It has an extremely low coefficient of thermal expansion. - It has excellent surface bonding properties.
The product complies with RoHS and Reach requirements and has passed safety certification by the UL laboratory in the United States.
The GL high-performance polyimide film is primarily used in high-precision adhesive FCCL substrates, high-stability cover films, chip packaging, and special adhesive tape substrates.
- Direct Manufacturer Pricing: Eliminate intermediaries—competitive costs, flexible MOQs, and fast delivery.
- Technical Expertise: Customized anti-fog testing for your product, and support to optimize packaging performance.
Available in custom thicknesses, widths, and finishes (matte, glossy, metallic), our Polyimide film ensures consistent quality, fast production, and competitive pricing for bulk orders. Contact us today for free samples & wholesale deals!
To ensure the longevity and performance of our Polyimide film, please adhere to the following guidelines:
- Shelf Life: 6 months from the date of manufacture.
- Storage Conditions:
· Store in a cool, dry place away from direct sunlight will be necessary.
· Avoid exposure to high humidity or extreme temperature fluctuations.
