| MOQ: | Negotiation |
| Price: | $300-$30000 |
| Standard Packaging: | Standard Packing |
| Delivery Period: | Negotiation |
| Payment Method: | L/C,T/T |
| Supply Capacity: | Negotiation |
PI Base Film for FPCs and Semiconductor Packaging
Flexible Printed Circuit Base Film: High Dimensional Stability Polyimide
It boasts superior mechanical performance, ultra-low CTE and great surface adhesiveness. The product meets RoHS & REACH standards and is safety-certified by US UL Labs.
GL high-spec polyimide film mainly serves high-precision adhesive FCCL base materials, dimensionally stable coverlays, chip packaging and specialty adhesive tape substrates.
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To ensure the longevity and performance of our Polyimide film, please adhere to the following guidelines:
· Store in a cool, dry place away from direct sunlight will be necessary.
· Avoid exposure to high humidity or extreme temperature fluctuations.