| MOQ: | 150 κιλά |
| Τιμή: | $300-$30000 |
| Τυπική συσκευασία: | Τυπική συσκευασία |
| Περίοδος παράδοσης: | 7 εργάσιμες ημέρες |
| Τρόπος πληρωμής: | L/c, t/t |
| Δυνατότητα ανεφοδιασμού: | Διαπραγμάτευση |
Our Polyimide Film with Copper Cladding is a high-performance composite material tailor-made for flexible circuit applications, integrating the exceptional properties of polyimide (PI) substrate and high-purity copper cladding. Designed to address the demands of "lightweight, bendable, and reliable" in modern flexible electronics, this product serves as a critical foundational component for devices requiring dynamic flexibility and stable signal transmission.
High Mechanical Sturdiness
Strong Mechanical Endurance
Superior Mechanical Toughness
Enhanced Mechanical Resilience
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