| MOQ: | 150kg |
| 価格: | $300-$30000 |
| 標準パッケージ: | 標準梱包 |
| 配達期間: | 7営業日 |
| 支払方法: | L/C、T/T |
| 供給能力: | 交渉 |
Our Polyimide Film with Copper Cladding is a high-performance composite material tailor-made for flexible circuit applications, integrating the exceptional properties of polyimide (PI) substrate and high-purity copper cladding. Designed to address the demands of "lightweight, bendable, and reliable" in modern flexible electronics, this product serves as a critical foundational component for devices requiring dynamic flexibility and stable signal transmission.
High Mechanical Sturdiness
Strong Mechanical Endurance
Superior Mechanical Toughness
Enhanced Mechanical Resilience
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