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Polyimide film with copper cladding for flexible circuit applications

Polyimide film with copper cladding for flexible circuit applications

MOQ: 150 kg
Price: $300-$30000
standard packaging: Imballaggio standard
Delivery period: 7 giorni lavorativi
payment method: L/c, t/t
Supply Capacity: Negoziazione
Informazioni Dettagliate
Luogo di origine
Cina
Marca
Guofeng
Certificazione
SGS Reach ROHS
Numero di modello
25um
Materiale del rivestimento:
Rame
Trattamento superficiale:
Incisione chimica
Materiale:
Poliimide
Tipo adesivo:
Acrilico
Evidenziare:

flexible copper clad polyimide film

,

polyimide film for circuits

,

copper cladding film with warranty

Product Description
              Polyimide film with copper cladding for flexible circuit applications
Product Overview:

Our Polyimide Film with Copper Cladding is a high-performance composite material tailor-made for flexible circuit applications, integrating the exceptional properties of polyimide (PI) substrate and high-purity copper cladding. Designed to address the demands of "lightweight, bendable, and reliable" in modern flexible electronics, this product serves as a critical foundational component for devices requiring dynamic flexibility and stable signal transmission.

Place of Origin:
ANHUI, CHINA
Material:
Polyimide
Color:
Yellow
Treatment:
Single-side / Both Sides
Width:
514MM, 520MM, 1028MM, 1040MM
Thickness:
custom
Packaging:
vacuum packaging
Supply Ability:
2000 ton/year
Product Features:

High Mechanical Sturdiness

Strong Mechanical Endurance

Superior Mechanical Toughness

Enhanced Mechanical Resilience


Product Applications:
  1. Flexible Solar Panels
  2. Flexible Photovoltaic Cells
  3. Healthcare Equipment

Product Images:


Company Image:

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