| MOQ: | 150 kg |
| Cena: | $300-$30000 |
| Standardowe opakowanie: | Standardowe pakowanie |
| Okres dostawy: | 7 dni roboczych |
| Metoda płatności: | L/C, T/T. |
| Wydajność dostaw: | Negocjacja |
Our Polyimide Film with Copper Cladding is a high-performance composite material tailor-made for flexible circuit applications, integrating the exceptional properties of polyimide (PI) substrate and high-purity copper cladding. Designed to address the demands of "lightweight, bendable, and reliable" in modern flexible electronics, this product serves as a critical foundational component for devices requiring dynamic flexibility and stable signal transmission.
High Mechanical Sturdiness
Strong Mechanical Endurance
Superior Mechanical Toughness
Enhanced Mechanical Resilience
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