| MOQ: | 150 kg |
| Price: | $300-$30000 |
| Standard Packaging: | Emballage standard |
| Delivery Period: | 7 jours ouvrables |
| Payment Method: | L / C, T / T |
| Supply Capacity: | Négociation |
Our Polyimide Film with Copper Cladding is a high-performance composite material tailor-made for flexible circuit applications, integrating the exceptional properties of polyimide (PI) substrate and high-purity copper cladding. Designed to address the demands of "lightweight, bendable, and reliable" in modern flexible electronics, this product serves as a critical foundational component for devices requiring dynamic flexibility and stable signal transmission.
High Mechanical Sturdiness
Strong Mechanical Endurance
Superior Mechanical Toughness
Enhanced Mechanical Resilience
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