| MOQ: | 150kg |
| 가격: | $300-$30000 |
| 표준 포장: | 표준 포장 |
| 배달 기간: | 7 영업일 |
| 결제수단: | l/c, t/t |
| 공급능력: | 협상 |
Our Polyimide Film with Copper Cladding is a high-performance composite material tailor-made for flexible circuit applications, integrating the exceptional properties of polyimide (PI) substrate and high-purity copper cladding. Designed to address the demands of "lightweight, bendable, and reliable" in modern flexible electronics, this product serves as a critical foundational component for devices requiring dynamic flexibility and stable signal transmission.
High Mechanical Sturdiness
Strong Mechanical Endurance
Superior Mechanical Toughness
Enhanced Mechanical Resilience
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