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Film Appearance: | The Surface Shall Exhibit Absolute Flatness And Must Be Entirely Free From Imperfections Including Folds, Air Pockets, Resin Globules, Or Foreign Matter Deposits. | Film Thickness: | 12.5μm |
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Film Tensile Strengthh: | 250MPa | Film Elongation At Break: | 45% |
Film Young's Modulus: | 5GPa | Film Insulation Strength: | 250V/μm |
Film Moisture Absorption: | 1425Kg/m³ | Film Thermal Shrinkage(200°,2h): | 0.06% |
Film Linear Expansion Coefficient: | 16ppm | Film Moisture Absorption Rate: | 1.8% |
Highlight: | Biaxially Stretched aluminized kapton film,molecular aluminized kapton film,molecular polyimide sheet |
Designed through cutting-edge molecular engineering, this high-performance substrate provides unparalleled structural durability, dielectric strength, and thermal endurance. Its exceptional surface compatibility guarantees faultless integration in precision assemblies, while carrying full international eco-compliance certifications (RoHS/REACH) and UL safety validation for global deployment.
As a cornerstone engineering material for next-gen electronic systems, GL-specification polyimide substrates deliver mission-critical operational parameters across: 1) micron-precision adhesive flexible copper-clad laminate architectures, 2) thermally invariant protective overlay systems, 3) cutting-edge chip-scale encapsulation platforms, and 4) application-specific pressure-sensitive tape formulations.
Contact Person: Jihao
Tel: +86 18755133999
Fax: 86-0551-68560865