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تفاصيل المنتج:
اتصل
نتحدث الآن
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| مادة الكسوة: | نحاس | المعالجة السطحية: | النقش الكيميائي |
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| مادة: | بوليميد | نوع لاصق: | الأكريليك |
| إبراز: | precision-laminated copper polyimide film,flex circuitry functional substrate,copper clad polyimide film substrate,flex circuitry functional substrate,copper clad polyimide film substrate |
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The GL series represents a significant advancement in polyimide film technology. Utilizing our proprietary biaxial stretching process, we engineer a molecularly oriented structure that delivers a consistent 30% enhancement in key properties—including tensile strength, dimensional stability, and chemical resistance—compared to standard alternatives. This high-performance, natural yellow polyimide film is available in customized thicknesses and is the preferred material for demanding applications such as adhesive substrates and advanced chip packaging.
Outstanding Mechanical Strength
Exceptional Dimensional Stability
Superior Laminating Properties
Conforms to RoHS and REACH regulations.
The GL high-performance polyimide film is primarily used in:
High-precision adhesive FCCL substrates
High-stability cover films
Chip packaging
Special adhesive tape substrates
To ensure the longevity and performance of our Polyimide film:
اتصل شخص: Jihao
الهاتف :: +86 18755133999
الفاكس: 86-0551-68560865
