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Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry

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Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry
Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry

Large Image :  Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry

Product Details:
Place of Origin: China
Brand Name: Guofeng
Certification: SGS Reach ROHS
Model Number: 25um
Payment & Shipping Terms:
Minimum Order Quantity: 150kg
Price: $300-$30000
Packaging Details: Standard Packing
Delivery Time: 7 Working Days
Payment Terms: L/C,T/T
Supply Ability: Negotiation
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Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry

Description
Cladding Material: Copper Surface Treatment: Chemical Etching
Material: Polyimide Adhesive Type: Acrylic

  Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry
Product Overview:

The GL series represents a significant advancement in polyimide film technology. Utilizing our proprietary biaxial stretching process, we engineer a molecularly oriented structure that delivers a consistent 30% enhancement in key properties—including tensile strength, dimensional stability, and chemical resistance—compared to standard alternatives. This high-performance, natural yellow polyimide film is available in customized thicknesses and is the preferred material for demanding applications such as adhesive substrates and advanced chip packaging.

Place of Origin:
ANHUI, CHINA
Material:
Polyimide
Color:
Yellow
Treatment:
Single-side / Both Sides
Width:
514MM, 520MM, 1028MM, 1040MM
Thickness:
custom
Packaging:
vacuum packaging
Supply Ability:
2000 ton/year
Product Features:

Outstanding Mechanical Strength

Exceptional Dimensional Stability

Superior Laminating Properties

Conforms to RoHS and REACH regulations.


Product Applications:

The GL high-performance polyimide film is primarily used in:

High-precision adhesive FCCL substrates

High-stability cover films

Chip packaging

Special adhesive tape substrates


Handling & Storage Instructions:

To ensure the longevity and performance of our Polyimide film:

  • Shelf Life: 6 months from the date of manufacture
  • Storage Conditions:
    • Store in a cool, dry place away from direct sunlight
    • Avoid exposure to high humidity or extreme temperature fluctuations
Product Images:

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry 0

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry 1

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry 2

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry 3

Company Image:

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry 4

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry 5

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry 6

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry 7

Tag:

pi heating film,

polyimide substrate,

polyamide imide film

Contact Details
Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.

Contact Person: Jihao

Tel: +86 18755133999

Fax: 86-0551-68560865

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