Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry

Outstanding Mechanical Strength

Exceptional Dimensional Stability

Superior Laminating Properties

Conforms to RoHS and REACH regulations.

The GL high-performance polyimide film is primarily used in:

High-precision adhesive FCCL substrates

High-stability cover films

Chip packaging

Special adhesive tape substrates

To ensure the longevity and performance of our Polyimide film:

• Shelf Life: 6 months from the date of manufacture
• Storage Conditions:
  • Store in a cool, dry place away from direct sunlight
  • Avoid exposure to high humidity or extreme temperature fluctuations