Şimdi konuşalım. |
Ana sayfa ÜrünlerBakır Kaplı Poliimid Film

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry

Tüm ürünler

PI malzemesi

(15)

Polyimid PI filmi

(16)

Polyimid ince film

(13)

Polyimid yalıtım bantı

(11)

FPC Filmi

(15)

Dielektrik film

(13)

Şeffaf poliamid filmi

(3)

Bakır Kaplı Poliimid Film

(10)

Polimer Film

(12)

polipropilen film

(1)
Sertifika
Çin Hefei Guofeng Advanced Basic Materials Technology Co., Ltd. Sertifikalar
Müşteri yorumları
Yenilikçiliğe ve iletişime duydukları coşkuyu takdir ediyoruz.

—— DNP

Satış sonrası tepkileri şimşek gibi hızlıydı. Sorunlar hemen çözüldü ve işbirliği sorunsuz oldu!

—— Itochu Corporation

Ben sohbet şimdi

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry
Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry

Büyük resim :  Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry

Ürün ayrıntıları:
Menşe yeri: ÇİN
Marka adı: Guofeng
Sertifika: SGS Reach ROHS
Model numarası: 25um
Ödeme & teslimat koşulları:
Min sipariş miktarı: 150kg
Fiyat: $300-$30000
Ambalaj bilgileri: standart paketleme
Teslim süresi: 7 İş Günü
Ödeme koşulları: L/C, T/T
Yetenek temini: Müzakere
İletişim Şimdi konuşalım.

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry

Açıklama
Kaplama malzemesi: Bakır Yüzey tedavisi: Kimyasal dağlama
Malzeme: Poliimid Yapışkan tipi: Akrilik
Vurgulamak:

precision-laminated copper polyimide film

,

flex circuitry functional substrate

,

copper clad polyimide film substrate

  Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry
Product Overview:

The GL series represents a significant advancement in polyimide film technology. Utilizing our proprietary biaxial stretching process, we engineer a molecularly oriented structure that delivers a consistent 30% enhancement in key properties—including tensile strength, dimensional stability, and chemical resistance—compared to standard alternatives. This high-performance, natural yellow polyimide film is available in customized thicknesses and is the preferred material for demanding applications such as adhesive substrates and advanced chip packaging.

Place of Origin:
ANHUI, CHINA
Material:
Polyimide
Color:
Yellow
Treatment:
Single-side / Both Sides
Width:
514MM, 520MM, 1028MM, 1040MM
Thickness:
custom
Packaging:
vacuum packaging
Supply Ability:
2000 ton/year
Product Features:

Outstanding Mechanical Strength

Exceptional Dimensional Stability

Superior Laminating Properties

Conforms to RoHS and REACH regulations.


Product Applications:

The GL high-performance polyimide film is primarily used in:

High-precision adhesive FCCL substrates

High-stability cover films

Chip packaging

Special adhesive tape substrates


Handling & Storage Instructions:

To ensure the longevity and performance of our Polyimide film:

  • Shelf Life: 6 months from the date of manufacture
  • Storage Conditions:
    • Store in a cool, dry place away from direct sunlight
    • Avoid exposure to high humidity or extreme temperature fluctuations
Product Images:

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry 0

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry 1

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry 2

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry 3

Company Image:

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry 4

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry 5

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry 6

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry 7

Etiket:

pi ısıtma filmi,

poliimid alt tabaka,

poliamid imid film

İletişim bilgileri
Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.

İlgili kişi: Jihao

Tel: +86 18755133999

Faks: 86-0551-68560865

Sorgunuzu doğrudan bize gönderin (0 / 3000)

Hakkında

PI malzemesi

D Tipi Sarı Termal Polyimid Isıtma Filmi Materyali Substratlar İçin

Kuantum İnce PI Malzemesi Polimid Nano Membran Esnek Biyoelektronik İçin

Fleksibel Elektronik ve FPC ODM için ROHS Polyimide PI Malzeme Filmi

Polyimid PI filmi

Esnek Elektronik Sarı Isıtma Polyimide PI Film Yüksek Sıcaklığa Dirençli

Geleneksel Şeffaf olmayan Siyah Polyimid İnce Film Maske Duvarı GB Standartı

Buhar Karbon Güçlendirilmiş Plastik Polyimide PI Isıtma Filmi GC50 Sınıfı Oem

Mesaj bırak

Gizlilik Politikası | Çin iyi Kalite PI malzemesi Tedarikçi. © 2025 Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.. All Rights Reserved.