UL 94 V-0 Advanced Copper Clad Polyimide Film Nanocomposite For Flexible Electronics

Key Differentiators

1. Enhanced Thermal Management

   • Thermal conductivity up to 0.8 W/m·K (2X conventional PI films)

   • Coefficient of thermal expansion (CTE) reduced to <10 ppm/°C (60% improvement)

2. Superior Mechanical Performance

   • 40% higher tear resistance and 30% improved tensile strength

   • Withstands over 200,000 dynamic flex cycles at 3mm bend radius

3. Advanced Processing Compatibility

   • Laser-drillable with 20μm microvias for HDI circuits

   • Compatible with thin-film transistor and semiconductor packaging processes

4. Reliability in Extreme Conditions

    

   • Maintains performance after 1000 hours at 85°C/85% RH

   • UV laser processable for high-precision patterning

Applications

• Flexible Displays: OLED substrate and touch sensor layers

• Medical Electronics: Implantable devices and flexible sensors

• Aerospace: Lightweight wiring systems and satellite components

• Wearable Technology: Advanced biometric monitoring systems

• Automotive: Flexible lighting systems and curved interior electronics

Why This Film?

This isn't just another polyimide film - it's a fundamentally advanced material platform enabling previously impossible flexible electronic designs. The combination of thermal, mechanical, and electrical properties creates new opportunities for innovation while providing unmatched reliability in demanding applications.