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Polyimide Base Substrates for FPC Manufacturing and Semiconductor Encapsulation & Packaging
| MOQ: | Negotiation |
| Price: | $300-$30000 |
| Standard Packaging: | Standard Packing |
| Delivery Period: | Negotiation |
| Payment Method: | L/C,T/T |
| Supply Capacity: | Negotiation |
Flexible Polyimide Film substrates
,Polyimide Base FPC manufacturing
,Semiconductor encapsulation Polyimide Film
Polyimide Base Substrates for FPC Manufacturing and Semiconductor Encapsulation & Packaging
Flexible Printed Circuit Base Film: High Dimensional Stability Polyimide
It boasts superior mechanical performance, ultra-low CTE and great surface adhesiveness. The product meets RoHS & REACH standards and is safety-certified by US UL Labs.
GL high-spec polyimide film mainly serves high-precision adhesive FCCL base materials, dimensionally stable coverlays, chip packaging and specialty adhesive tape substrates.
To ensure the longevity and performance of our Polyimide film, please adhere to the following guidelines:
- Shelf Life: 6 months from the date of manufacture.
- Storage Conditions:
· Store in a cool, dry place away from direct sunlight will be necessary.
· Avoid exposure to high humidity or extreme temperature fluctuations.
