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ODM Polyimide Film Adhesive Substrate For Flexible Electronics Chip Packaging

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ODM Polyimide Film Adhesive Substrate For Flexible Electronics Chip Packaging

ODM Polyimide Film Adhesive Substrate For Flexible Electronics Chip Packaging
ODM Polyimide Film Adhesive Substrate For Flexible Electronics Chip Packaging ODM Polyimide Film Adhesive Substrate For Flexible Electronics Chip Packaging

Large Image :  ODM Polyimide Film Adhesive Substrate For Flexible Electronics Chip Packaging

Product Details:
Place of Origin: China
Brand Name: Guofeng
Certification: SGS Reach ROHS
Model Number: 25um
Payment & Shipping Terms:
Minimum Order Quantity: 150kg
Price: $300-$30000
Packaging Details: Standard Packing
Delivery Time: 7 Working Days
Payment Terms: L/C,T/T
Supply Ability: Negotiation
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ODM Polyimide Film Adhesive Substrate For Flexible Electronics Chip Packaging

Description
Highlight:

ODM polyimide film adhesive

,

Electronics polyimide film adhesive

,

ODM polyimide substrate

Polyimide Film Substrate with Low Thermal Expansion for Flexible Electronics
Product Overview

The GL high-performance polyimide film is a type of biaxially stretched natural (yellow) polyimide film, developed and produced independently by our company. Available in various thicknesses and characteristics, it is primarily used in adhesive substrates, chip packaging, and other specialized applications.

Place of Origin:
ANHUI, CHINA
Certification:
SGS, FDA
Material:
Polyimide
Color:
Yellow
Treatment:
Single-side / Both Sides
Width:
514MM, 520MM, 1028MM, 1040MM
Thickness:
5μm, 7.5μm, 11μm, 12.5μm, 25μm, 50μm, 70μm, 75μm, 100μm
Packaging:
Wooden pallet
Supply Ability:
2000 ton/year
Product Features
  • Extremely high mechanical properties
  • Extremely low coefficient of thermal expansion
  • Excellent surface bonding properties
  • Complies with RoHS and Reach requirements
  • UL laboratory safety certified (United States)
Product Applications

The GL high-performance polyimide film is primarily used in:

  • High-precision adhesive FCCL substrates
  • High-stability cover films
  • Chip packaging
  • Special adhesive tape substrates
Why Choose Our Factory?
  • Direct Manufacturer Pricing: Eliminate intermediaries with competitive costs, flexible MOQs, and fast delivery
  • Technical Expertise: Customized anti-fog testing and packaging optimization support

Available in custom thicknesses, widths, and finishes (matte, glossy, metallic), our Polyimide film ensures consistent quality, fast production, and competitive pricing for bulk orders. Contact us today for free samples & wholesale deals!

Handling & Storage Instructions

To ensure the longevity and performance of our Polyimide film:

  • Shelf Life: 6 months from the date of manufacture
  • Storage Conditions:
    • Store in a cool, dry place away from direct sunlight
    • Avoid exposure to high humidity or extreme temperature fluctuations
Product Images

ODM Polyimide Film Adhesive Substrate For Flexible Electronics Chip Packaging 0

ODM Polyimide Film Adhesive Substrate For Flexible Electronics Chip Packaging 1

ODM Polyimide Film Adhesive Substrate For Flexible Electronics Chip Packaging 2

Tag:

pi heating film,

polyimide substrate,

polyamide imide film

Contact Details
Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.

Contact Person: Mr. Jihao

Tel: +86 18755133999

Fax: 86-0551-68560865

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