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Heat Resistant Kapton Tape Material Aluminized Polyimide Matrix Film

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Heat Resistant Kapton Tape Material Aluminized Polyimide Matrix Film

Heat Resistant Kapton Tape Material Aluminized Polyimide Matrix Film
Heat Resistant Kapton Tape Material Aluminized Polyimide Matrix Film Heat Resistant Kapton Tape Material Aluminized Polyimide Matrix Film

Large Image :  Heat Resistant Kapton Tape Material Aluminized Polyimide Matrix Film

Product Details:
Place of Origin: China Hefei
Brand Name: Guofeng
Certification: UL ISO RoHS
Model Number: 50um
Payment & Shipping Terms:
Minimum Order Quantity: 5kg
Price: $300-$30000
Packaging Details: Barrier+ PE foam sheet+ PE film+ Foam packing cotton
Delivery Time: Negotiation
Payment Terms: L/C,T/T
Supply Ability: Negotiation
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Heat Resistant Kapton Tape Material Aluminized Polyimide Matrix Film

Description
Film Appearance: The Substrate Must Maintain Nanometer-level Planarity While Demonstrating Complete Absence Of Topological Defects, Particulate Inclusions, Polymeric Agglomerations, Or Extraneous Contamination Across Its Entire Functional Area. Film Thickness: 50μm
Film Tensile Strengthh: 450MPa Film Elongation At Break: 35%
Film Young's Modulus: 9GPa Film Insulation Strength: 350V/μm
Film Moisture Absorption: 1425Kg/m³ Film Thermal Shrinkage(200°，2h): 0.04%
Film Linear Expansion Coefficient: 8ppm Film Moisture Absorption Rate: 2%
Highlight:

Polyimide kapton tape material

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Heat Resistant kapton tape material

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Matrix aluminized polyimide film

      GL50 High-Temperature Resistant Polyimide Matrix with Inherent Spectral Filtering Properties
Leveraging proprietary macromolecular design, our Generation-Lambda technology platform integrates autogenously synthesized biaxially-aligned polyimide networks exhibiting intrinsic spectral transmission characteristics. The product ecosystem provides trichotomous performance gradations with engineered polymer morphologies, specifically architected for premium dielectric interlayers in next-generation semiconductor packaging paradigms and precision surface-bonding substrate solutions demanding nanoscale interfacial control.
Key Advantages:

Engineered via pioneering nanostructural synthesis techniques, this elite-grade dielectric foundation delivers unmatched mechanical resilience, electrical insulation robustness, and extreme-temperature operational stability. The material's optimized interfacial characteristics ensure zero-defect incorporation in high-tolerance assemblies, while maintaining comprehensive global environmental regulatory approvals (EU RoHS/REACH) and internationally recognized UL safety certification for worldwide implementation.

 

Product application:
Operating as an elemental industrial material, GL-classified polyimide diaphragms establish essential substrate infrastructure for advanced fabrication processes including: 1) pliable electronic shielding Stratum systems, 2) high-density interconnection modules, and 3) quantum-grade electrical insulation partitions.
Place of Origin:
ANHUI, CHINA
Certification:
SGS, FDA
Material:
Polyimide
Color:
Yellow
 
Width:
514MM, 520MM, 1028MM, 1040MM.etc
Thickness:
 50μm
Packaging:
Wooden pallet
Product Features
This molecularly engineered composite exhibits groundbreaking mechanical integrity with superior crack propagation resistance and extended operational longevity, augmented by exceptional dimensional invariance originating from its ultralow coefficient of thermal expansion (CTE < 5 ppm/K). The material demonstrates elite interfacial adhesion properties enabling fault-tolerant device integration, while achieving certified compliance with global hazardous materials directives (EU RoHS 3) and chemical substance registration frameworks (REACH Annex XVII). Additionally, it possesses multi-jurisdictional safety accreditation from the International Electrotechnical Commission (IEC) and Underwriters Laboratories certification for cross-border deployment.
Product Applications

Acting as critical facilitation platforms for next-wave electronic applications, Generation-Leadership specification polyimide composites deliver architecture-vital performance benchmarks across: 1) sub-micrometer precision laminated flex-circuit assemblies, 2) geometrically stable protective interface matrices, 3) vanguard chip-scale integration environments, and 4) application-optimized bonding films with tunable rheological properties.

Product Images
Heat Resistant Kapton Tape Material Aluminized Polyimide Matrix Film 0Heat Resistant Kapton Tape Material Aluminized Polyimide Matrix Film 1


 

Tag:

aluminized kapton film,

polyimide material,

polyimide insulation tape

Contact Details
Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.

Contact Person: Jihao

Tel: +86 18755133999

Fax: 86-0551-68560865

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