Polyimide Core Film for Flexible Printed Circuits & Semiconductor Packaging Fields

    Polyimide Core Film for Flexible Printed Circuits & Semiconductor Packaging Fields

GL-Type Polyimide Film delivers outstanding heat resistance, dielectric performance, and consistent dimensional integrity. Its distinctive matte black finish makes it a preferred material in consumer electronics, flex PCB applications, and semiconductor encapsulation, combining high reliability with effective optical shielding.

• It has extremely high mechanical properties.
  It has an extremely low coefficient of thermal expansion.
• It has excellent surface bonding properties.
  The product complies with RoHS and Reach requirements and has passed safety certification by the UL laboratory in the United States.

The GL high-performance polyimide film is primarily used in high-precision adhesive FCCL substrates, high-stability cover films, chip packaging, and special adhesive tape substrates.

• Direct Manufacturer Pricing: Eliminate intermediaries—competitive costs, flexible MOQs, and fast delivery.
• Technical Expertise: Customized anti-fog testing for your product, and support to optimize packaging performance.

Available in custom thicknesses, widths, and finishes (matte, glossy, metallic), our Polyimide film ensures consistent quality, fast production, and competitive pricing for bulk orders. Contact us today for free samples & wholesale deals!

To ensure the longevity and performance of our Polyimide film, please adhere to the following guidelines:

• Shelf Life: 6 months from the date of manufacture.
• Storage Conditions:

  · Store in a cool, dry place away from direct sunlight will be necessary.

  · Avoid exposure to high humidity or extreme temperature fluctuations.